lead free reflow soldering oven hc rf8800

Lead Free Reflow Soldering Oven HC-RF8800

■ 8 Zones Design (8 upper 8 down)
■ PID Close Loop Control + SSR Driving
■ Nitrogen Option Available
Ideal for Small-Volume Production: Suitable for EMS factories, contract manufacturers, and R&D labs that require high-quality soldering without the cost and footprint of full industrial-scale ovens.
Hybrid Heating Technology: Upper hot air + lower IR heating, with independent temperature and airflow adjustment, optimized for high precision lead-free soldering

SPECIFICATIONS

Model HC-RF8800
Machine Dimension 4200*800*1250MM
Machine Weight 800KGS
Heating Zones Top 8 / Bottom 8
Heating Zones Length 2400MM
Exhaust Volume 20-25m³/min*2
Exhaust Pipe 2*φ200mm
Cooling Method Forced-Air
Heating Method Top Zones: Hot Air, Bottom Zones: Infrared
Power Supply 5-Wire 3-Phase 380V 50/60Hz (Optional: 3-Phase 220V 50/60Hz)
Total Power 36 KW
Starting Power 32 KW
Normal Operating Power 4 KW
Heating Up Time About 25 minutes
Temp. Setting Range Room Temp. ~300℃
Temperature Control Method PID Close Loop Control + SSR Driving + Touch Screen
Temperature Control Precision ±1.0℃
Temperature Deviation on PCB ±1.0℃ (By MR Board Test Standard)
Abnormal Alarm Abnormal Temperature (Extra-high/Extra-low Temp.)
Mesh Width 400MM
Components Clearance 50MM
Conveyor Direction Left → Right (Optional: Right → Left)
Transmission Method Mesh
Conveyor Height 880±20MM
Conveyor Speed Range 100~2000MM/Min

Contact Us

If you are planning to build or upgrade your SMT/THT production line, our engineering team can provide a free layout design, equipment configuration, and quotation within 24 hours.

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Chenzhou Heech Electronic Equipment Co.,Ltd






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