lead free hot air reflow oven hc rf800a

Lead-free Hot Air Reflow Oven HC-RF800A

■ 8 Zones Design (8 upper 8 down)
■ PID Close Loop Control + SSR Driving
■ Nitrogen Option Available
8-Zone Temperature Control (8-Up / 8-Down):It’s provide precise reflow profiling for various PCB types, component sizes, and solder pastes. Ensures uniform heating on both PCB surfaces and consistent soldering quality across the board.
Ideal for Medium-to-Large Production: Designed for EMS factories, contract manufacturers and complex PCB assemblies.

SPECIFICATIONS

Model HC-RF800A
Machine Dimension 5240*1350*1550MM
Machine Weight 2050KGS
Heating Zones Top 8 / Bottom 8
Heating Zones Length 3121MM
Exhaust Volume 20-25m³/min*2
Exhaust Pipe 2*φ200mm
Colling Zones Upper 2 Lower 2
Heating Chamber Structure Modular Type
Heating Method Full Hot Air from Top and Bottom
Power Supply 5-Wire 3-Phase 380V 50/60Hz (Optional: 3-Phase 220V 50/60Hz)
Total Power 55KW
Starting Power 25KW
Normal Operating Power 7KW
Heating Up Time About 25 minutes
Temp. Setting Range Room Temp. ~300℃
Temperature Control Method PID Close Loop Control + SSR Driving, monitored by Siemens PLC + PC
Temperature Control Precision ±1.0℃
Temperature Deviation on PCB ±1.0℃ (By MR Board Test Standard)
Abnormal Alarm Abnormal Temperature (Extra-high/Extra-low Temp.)
Mesh Width 500MM
Max Rail Width 400MM
Components Clearance Top / Bottom Clearance of PCB is 25MM
Conveyor Direction Left → Right (Optional : Right → Left)
Transmission Method Chain + Mesh
Conveyor Height 900±20MM
Conveyor Speed Range 300~2000MM/Min

Contact Us

If you are planning to build or upgrade your SMT/THT production line, our engineering team can provide a free layout design, equipment configuration, and quotation within 24 hours.

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Chenzhou Heech Electronic Equipment Co.,Ltd






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