automaitc lead free reflow soldering oven hc rf8820

High Throughput Production Reflow Oven HC-1200C

■ 12 Zones Design (12 upper 12 down)
■ PID Close Loop Control + SSR Driving
■ Nitrogen Option Available
Reflow Oven HC-RF1200C is designed for high-volume SMT production lines that demand maximum thermal precision and throughput. This system delivers exceptional temperature uniformity, minimal PCB warpage, and stable reflow performance for complex, high-density PCB assemblies.
It suitable for EMS factories, large OEM production lines, and high-density PCB manufacturers.

SPECIFICATIONS

Model HC-RF1200C
Machine Dimension 6760*1350*1550MM
Machine Weight 2400KGS
Heating Zones Top 12 / Bottom 12
Heating Zones Length 4600MM
Exhaust Volume 20-25m³/min*2
Exhaust Pipe 2*φ200mm
Cooling Zones Upper 2 Lower 2
Heating Method Full Hot Air from Top and Bottom
Heating Chamber Structure Modular Type
Power Supply 5-Wire 3-Phase 380V 50/60Hz (Optional: 3-Phase 220V 50/60Hz)
Total Power 62KW
Starting Power 46KW
Normal Operating Power 12KW
Heating Up Time About 25 minutes
Temp. Setting Range Room Temp. ~300℃
Temperature Control Method PID Close Loop Control + SSR Driving, monitored by Siemens PLC + PC
Temperature Control Precision ±1.0℃
Temperature Deviation on PCB ±1.0℃ (By MR Board Test Standard)
Abnormal Alarm Abnormal Temperature (Extra-high/Extra-low Temp.)
Mesh Width 500MM
Max Rail Width 400MM
Components Clearance Top / Bottom Clearance of PCB is 25MM
Conveyor Direction Left → Right (Optional: Right → Left)
Transmission Method Chain + Mesh
Conveyor Height 900±20MM
Conveyor Speed Range 300~2000MM/Min

Contact Us

If you are planning to build or upgrade your SMT/THT production line, our engineering team can provide a free layout design, equipment configuration, and quotation within 24 hours.

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Chenzhou Heech Electronic Equipment Co.,Ltd






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