lead free hot air reflow oven hc rf635c

Lead Free Hot Air Reflow Oven HC-RF635C

■ 6 Zones Design (6 upper 6 down)
■ PID Close Loop Control + SSR Driving
■ Nitrogen Option Available
Ideal for Small to Medium-Volume Production: Suitable for EMS factories, contract manufacturers, and R&D labs that require high-quality soldering without the cost and footprint of full industrial-scale ovens.
Hybrid Heating Technology: Upper hot air + lower IR heating, with independent temperature and airflow adjustment, optimized for high precision lead-free soldering

SPECIFICATIONS

Model HC-RF635 HC-RF635C
Machine Dimension 3500 × 850 × 1550MM
Machine Weight 800KGS
Heating Zones Top 6 / Bottom 6
Heating Zones Length 2400MM
Exhaust Volume 20–25m³/min × 2
Exhaust Pipe 2 × φ200mm
Cooling Method Forced-Air
Heating Method Top: Hot Air / Bottom: Infrared
Power Supply 5-Wire 3-Phase 380V 50/60Hz (Optional: 3-Phase 220V 50/60Hz)
Total Power 24KW
Starting Power 15KW
Normal Operating Power 6KW
Heating Up Time About 20 minutes
Temp. Setting Range Room Temp. ~ 300℃
Temperature Control Method PID + SSR + Touch Screen PID + SSR + Siemens PLC + PC
Temperature Control Precision ±1.0℃
Temperature Deviation on PCB ±1.50℃ (By MR Board Test Standard)
Abnormal Alarm Abnormal Temperature (Extra-high / Extra-low Temp.)
Mesh Width 400MM 400MM
Max Rail Width / 300MM
Components Clearance 50MM Top / Bottom Clearance of PCB is 25MM
Conveyor Direction Left → Right (Optional: Right → Left)
Transmission Method Mesh Chain + Mesh
Conveyor Height 880 ± 20MM 900 ± 20MM
Conveyor Speed Range 100 ~ 2000MM/Min

Contact Us

If you are planning to build or upgrade your SMT/THT production line, our engineering team can provide a free layout design, equipment configuration, and quotation within 24 hours.

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Chenzhou Heech Electronic Equipment Co.,Ltd






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